| Kōmaka | tūemi | Te kaha noa | Te kaha motuhake |
| tatau paparanga | PCB mārō-flex | 2-14 | 2-24 |
| Takahuri PCB | 1-10 | 1-12 | |
| poari | 0.08 +/- 0.03mm | 0.05 +/- 0.03mm | |
| Min.Mātotoru | |||
| Max.Mātotoru | 6mm | 8mm | |
| Max.Rahi | 485mm * 1000mm | 485mm * 1500mm | |
| Kohao & Mokowhiti | Min.Kohao | 0.15mm | 0.05mm |
| Min.Slot Hole | 0.6mm | 0.5mm | |
| Aspect Ratio | 10:01 | 12:01 | |
| Tohu | Min.Width / Mokowā | 0.05 / 0.05mm | 0.025 / 0.025mm |
| Te manawanui | Tohu W/S | ± 0.03mm | ± 0.02mm |
| (W/S≥0.3mm:±10%) | (W/S≥0.2mm:±10%) | ||
| Kohao ki te poka | ± 0.075mm | ± 0.05mm | |
| Ahu Puka | ± 0.075mm | ± 0.05mm | |
| Te aukati | 0 ≤ Uara ≤ 50Ω : ± 5Ω 50Ω ≤ Uara : ± 10%Ω | ||
| Rauemi | Whakatakotoranga Basefilm | PI: 3mil 2mil 1mil 0.8mil 0.5mil | |
| ED&RA Cu : 2OZ 1OZ 1 / 2OZ 1 / 3OZ 1 / 4OZ | |||
| Basefilm Kaiwhakarato Matua | Shengyi / Taiflex / Dupont / Doosan / Thinflex | ||
| Whakatakotoranga hipoki | PI: 2mil 1mil 0.5mil | ||
| LPI Tae | Kākāriki / Kōwhai / Mā / Pango / Kahurangi / Whero | ||
| PI Whakakaha | T: 25um ～250um | ||
| FR4 Whakakaha | T: 100um ～2000um | ||
| SUS Whakakaha | T: 100um ～400um | ||
| AL Stiffener | T: 100um ～1600um | ||
| rīpene | 3M / Tesa / Nitto | ||
| EMI whakangungu rakau | Kiriata Hiriwa / Parahi / Waituhi Hiriwa | ||
| Whakaoti mata | OSP | 0.1 - 0.3um | |
| HASL | Sn: 5um - 40um | ||
| HASL(Leed kore utu) | Sn: 5um - 40um | ||
| ENEPIG | Ni: 1.0 - 6.0um | ||
| Ba: 0.015-0.10um | |||
| Au : 0.015 - 0.10um | |||
| Te whakakikorua koura pakeke | Ni: 1.0 - 6.0um | ||
| Au: 0.02um - 1um | |||
| Koura koura | Ni: 1.0 - 6.0um | ||
| Au: 0.02um - 0.1um | |||
| ENIG | Ni: 1.0 - 6.0um | ||
| Au : 0.015um - 0.10um | |||
| Hiriwa ruku | Ag : 0.1 - 0.3um | ||
| Tiini whakakikorua | Sn: 5um - 35um | ||
| SMT | Momo | 0.3mm pitch Hononga | |
| 0.4mm pitch BGA / QFP / QFN | |||
| 0201 Wae |